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IEC TS 63709-2 ED1

Function and the mechanical dimensions of the interfaces of liquid cooling for IT applications<br /> Part 2: Single phase direct to chip liquid cooling components in electronic enclosures in the IEC60297 series of standards

General information

20.99     Nov 28, 2025

CD    Mar 27, 2026

IEC

TC 48/SC 48D

Technical Specification

Life cycle

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IN_DEVELOPMENT
IEC TS 63709-2 ED1
20.99 WD approved for registration as CD
Nov 28, 2025