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IEC TS 63709-2 ED1

Function and the mechanical dimensions of the interfaces of liquid cooling for IT applications<br /> Part 2: Single phase direct to chip liquid cooling components in electronic enclosures in the IEC60297 series of standards

General information

50.00     Jul 16, 2026

CDTS    Sep 10, 2026

IEC

TC 48/SC 48D

Technical Specification

Life cycle

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IN_DEVELOPMENT
IEC TS 63709-2 ED1
50.00 Final text received or FDIS registered for formal approval
Jul 16, 2026