IEC TS 63709-2 ED1

Function and the mechanical dimensions of the interfaces of liquid cooling for IT applications<br /> Part 2: Single phase direct to chip liquid cooling components in electronic enclosures in the IEC60297 series of standards

General information

Current stage: 30.20 Effective date: Apr 17, 2026

Next stage: PCC Next stage date: Jun 12, 2026

Originator: IEC

Owner: TC 48/SC 48D

Type: Technical Specification

Life cycle

NOW

IN_DEVELOPMENT
IEC TS 63709-2 ED1
30.20 CD study/ballot initiated
Apr 17, 2026

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