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IEC 61190-1-3 ED4

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

General information

20.99     Dec 20, 2024

CD    Jan 30, 2026

IEC

TC 91

International Standard

31.190  

Life cycle

PREVIOUSLY

PUBLISHED
IEC 61190-1-3:2017 ED3

NOW

IN_DEVELOPMENT
IEC 61190-1-3 ED4
20.99 WD approved for registration as CD
Dec 20, 2024