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IEC 63609-3 ED1

Measurement method used in thermal design for electronics assemblies - Part 3: Temperature measurement method for miniaturized SMDs on circuit boards

General information

20.99     Nov 1, 2024

CD    Oct 31, 2025

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63609-3 ED1
20.99 WD approved for registration as CD
Nov 1, 2024