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IEC 63378-6-1 ED1

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

General information

60.00     May 11, 2026

BPUB    Aug 3, 2026

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63378-6-1 ED1
60.00 Standard under publication
May 11, 2026