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IEC 63378-6-1 ED1

Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device

General information

50.99     Jan 23, 2026

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63378-6-1 ED1
50.99 FDIS or proof approved for publication
Jan 23, 2026