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IEC 63546-1 ED1

Required Specification Of Package Substrates For Advanced Semiconductor Packaging - Part 1: Current-Induced Quality Test Method for Package Substrate

General information

20.99     Jun 21, 2024

CD    Dec 31, 2024

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63546-1 ED1
20.99 WD approved for registration as CD
Jun 21, 2024