IEC 60851-5:2026 specifies the following tests:
Test 5: Electrical resistance;
Test 13: Breakdown voltage;
Test 14: Continuity of insulation;
Test 19: Dielectric dissipation factor;
Test 23: Pin hole.
For definitions, general notes on methods of test and the complete series of methods of test for winding wires, see IEC 60851-1. This part of IEC 60851 also specifies methods for determining the dissipation factor of enamelled winding wire, provided in Annex A.
This fifth edition cancels and replaces the fourth edition published in 2008, Amendment 1:2011 and Amendment 2:2019. This edition constitutes a technical revision.
This edition includes the following significant technical changes with respect to the previous edition:
a) Subclauses 5.3.1 and 5.3.2 modified to expand the conductor size range for the loads applied during cylinder method testing for dielectric breakdown voltage of enameled wires and for fully insulated wires.
b) Addition of subclause 6.5 for inline continuity testing of rectangular wire (under consideration).
PUBLISHED
IEC 60851-5:2008 ED4
PUBLISHED
IEC 60851-5:2008/AMD1:2011 ED4
PUBLISHED
IEC 60851-5:2008/AMD2:2019 ED4
IN_DEVELOPMENT
IEC 60851-5 ED5
50.00
Final text received or FDIS registered for formal approval
Apr 16, 2026