Revised
applies to fixed unencapsulated surface mount multilayer capacitors of ceramic dielectric, Class 2, for use in electronic equipment. These capacitors have metallized connecting pads or soldering strips and are intended to be mounted on printed boards, or directly onto substrates for hybrid circuits.
The contents of the corrigendum of September 2004 have been included
in this copy.
WITHDRAWN
IEC 60384-10:1989 ED2
WITHDRAWN
IEC 60384-10:1989/AMD1:1993 ED2
WITHDRAWN
IEC 60384-10:1989/AMD2:2000 ED2
WITHDRAWN
IEC 60384-10-1:1989 ED1
WITHDRAWN
IEC 60384-10-1:1989/AMD1:1993 ED1
WITHDRAWN
IEC 60384-22:2004 ED1
99.60
Withdrawal effective
Dec 9, 2011
WITHDRAWN
IEC 60384-22:2004/COR1:2004 ED1
WITHDRAWN
IEC 60384-22:2011 ED2