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IEC 60068-2-58:2004 ED3

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Jul 15, 2004

General information

99.60     Mar 27, 2015

IEC

TC 91

International Standard

19.040     31.190  

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Scope

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-58:1999 ED2

NOW

WITHDRAWN
IEC 60068-2-58:2004 ED3
99.60 Withdrawal effective
Mar 27, 2015

REVISED BY

PUBLISHED
IEC 60068-2-58:2015 ED4