IEC 60749-15:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

Publication date: Feb 7, 2003

General information

Current stage: 99.60 Effective date: Oct 28, 2010

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French

Buying

Status: Revised

PDF - ALL 2,261

Paper - ALL 2,261

CD - ALL 2,261

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Scope

Describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads, by using wave soldering or a soldering iron.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62174:2000 ED1

NOW

WITHDRAWN
IEC 60749-15:2003 ED1
99.60 Withdrawal effective
Oct 28, 2010

REVISED BY

WITHDRAWN
IEC 60749-15:2010 ED2