IEC TR 61760-3-1:2022 ED1

Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method

Publication date: Jun 17, 2022

General information

Current stage: 60.60 Effective date: Jun 17, 2022

Originator: IEC

Owner: TC 91

Type: Technical Report

ICS: 31.190

Languages: English

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Status: Published

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Scope

IEC TR 61760-3-1:2022(E) supplements IEC 61760-3 to describe examples of solder paste supply methods, the relationship between the terminal position tolerance and the through hole diameter, and provides guidelines for the design of printed circuit boards with solder paste surface printing method, including specific examples.

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PUBLISHED
IEC TR 61760-3-1:2022 ED1
60.60 Standard published
Jun 17, 2022