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IEC PAS 62191:2000 ED1

Acoustic microscopy for nonhermetic encapsulated electronic components

Nov 28, 2000
95.99 Withdrawal of Standard   Jan 31, 2002

General information

95.99     Jan 31, 2002

IEC

TC 47

Publicly Available Specification

31.080.01  

English  

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Scope

Defines the procedures for performing acoustic microscopy on nonhermetic encapsulated electronic components. Provides users with an acoustic microscopy process flow for detecting anomalies (delamination, cracks, mold compounds voids, etc.) nondestructively in plastic packages while achieving reproducibility.

Life cycle

NOW

WITHDRAWN
IEC PAS 62191:2000 ED1
95.99 Withdrawal of Standard
Jan 31, 2002

REVISED BY

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2