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IEC PAS 62182:2000 ED1

Preconditioning of nonhermetic surface mount devices prior to reliability testing

Sep 14, 2000

General information

99.60     Jan 20, 2005

IEC

TC 47

Publicly Available Specification

31.080.01  

English  

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Replaced

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Scope

Establishes an industry standard preconditioning flow for nonhermetic solid state surface mount devices that is representative of a typical industry multiple solder reflow operation.

Life cycle

NOW

WITHDRAWN
IEC PAS 62182:2000 ED1
99.60 Withdrawal effective
Jan 20, 2005

REVISED BY

WITHDRAWN
IEC 60749-30:2005 ED1