Published
IEC TR 62433-4-1:2025 provides an overview of good practices to extract an ICIM-CI model from measurements and to build a numerical model of the PCB in which the ICIM-CI model is used to predict RF immunity of an IC in its application PCB.
This document also discusses factors which can be considered to obtain proper results in an ICIM-CI model extraction and use of the actual model at the PCB level.
PUBLISHED
IEC TR 62433-4-1:2025 ED1
60.60
Standard published
Aug 26, 2025