IEC 62899-202-9:2023 ED1

Printed electronics - Part 202-9: Materials - Conductive ink - Printed patterns for mechanical test

Publication date: Aug 3, 2023

General information

Current stage: 60.60 Effective date: Aug 3, 2023

Originator: IEC

Owner: TC 119

Type: International Standard

ICS: 31.180 87.080

Languages: English

Buying

Status: Published

PDF - ALL 9,046

Paper - ALL 9,046

CD - ALL 9,046

Language

Language in which you want to receive the document.

Scope

IEC 62899-202-9:2023 describes basic patterns to evaluate the electrical reliability of a conductive layer under mechanical deformation. Using the standard pattern described in this document, the comparison of the electrical reliability of a conductive layer under mechanical deformation is possible when the sample dimension is identical.

Life cycle

NOW

PUBLISHED
IEC 62899-202-9:2023 ED1
60.60 Standard published
Aug 3, 2023