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IEC 60539-2:2019 ED2

Directly heated negative temperature coefficient thermistors - Part 2: Sectional specification - Surface mount negative temperature coefficient thermistors

Jul 19, 2019

General information

60.60     Jul 19, 2019

IEC

TC 40

International Standard

31.040.30  

English  

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Scope

IEC 60539-2:2019 is applicable to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.
This edition includes the following significant technical changes with respect to the previous edition:
a) revision for the structure in accordance with ISO/IEC Directives, Part 2:2016 (seventh edition) to the extent practicable, and for harmonizing with IEC 60539-1:2016;
b) the upper category temperatures of 175 °C, 200 °C, 250 °C, 315 °C, 400 °C in Table 1 have been added;
c) the dimensions of 0402M in Annex A have been added.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60539-2:2003 ED1

WITHDRAWN
IEC 60539-2:2003/AMD1:2010 ED1

NOW

PUBLISHED
IEC 60539-2:2019 ED2
60.60 Standard published
Jul 19, 2019