SSH EN IEC 60286-3:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

Publication date: Jun 23, 2023

General information

Current stage: 60.60 Effective date: Jun 23, 2023

Next stage: 95.99

Originator: DPS

Owner: DPS/KT 7

Type: European Norm

ICS: 31.020 31.240

Languages: English

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Status: Published

PDF - ALL 5,236

Paper - ALL 5,236

CD - ALL 5,236

PDF and Paper - ALL 10,472

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Scope

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.
This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

Life cycle

PREVIOUSLY

PUBLISHED
SSH EN IEC 60286-3:2019

NOW

PUBLISHED
SSH EN IEC 60286-3:2022
60.60 Standard published
Jun 23, 2023

SSH EN IEC 60286-3:2022

Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes

General information

Buying

Scope

Life cycle

PREVIOUSLY

NOW

Related project

Adopted from EN IEC 60286-3:2022

Adopted from IEC 60286-3:2022