This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
An indication of the forms generally available is also included.
WITHDRAWN
SSH EN ISO 9453:2014
PUBLISHED
SSH EN ISO 9453:2020
60.60
Standard published
Apr 12, 2021