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SSH EN ISO 9455-14:2017

Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)

May 8, 2018

General information

60.60     Jan 30, 2018

DPS

DPS/KT 133

European Norm

25.160.50  

English  

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Scope

ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

Life cycle

PREVIOUSLY

WITHDRAWN
SSH EN 29455-14:1993

NOW

PUBLISHED
SSH EN ISO 9455-14:2017
60.60 Standard published
Jan 30, 2018

Related project

Adopted from EN ISO 9455-14:2017