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SSH EN ISO 9455-5:2014

Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014)

Mar 23, 2015
95.99 Withdrawal of Standard   Apr 12, 2021

General information

95.99     Apr 12, 2021

DPS

DPS/KT 133

European Norm

25.160.50  

English  

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Scope

ISO 9455-5:2014 specifies a qualitative method for assessing the aggressiveness of a flux towards copper. The test is applicable to all fluxes of type 1 as defined in ISO 9454‑1.

Life cycle

PREVIOUSLY

WITHDRAWN
SSH EN 29455-5:1993

NOW

WITHDRAWN
SSH EN ISO 9455-5:2014
95.99 Withdrawal of Standard
Apr 12, 2021

REVISED BY

PUBLISHED
SSH EN ISO 9455-5:2020

Related project

Adopted from EN ISO 9455-5:2014