Published
IEC 60684-3-281:2010 gives the requirements for two types of heat-shrinkable, polyolefin sleeving, semiconductive, with a nominal shrink ratio of 3:1. This sleeving has been found suitable up to temperatures of 100 °C. - Type A: Thin wall - Internal diameter up to 195,0 mm typically; - Type B: Medium wall - Internal diameter up to 120,0 mm typically
PUBLISHED
SSH EN 60684-3-281:2010
60.60
Standard published
Apr 28, 2011
IN_DEVELOPMENT
prSSH EN IEC 60684-3-281:2025