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SSH EN ISO 9453:2006

Soft solder alloys - Chemical compositions and forms (ISO 9453:2006)

Oct 24, 2011
95.99 Withdrawal of Standard   Mar 23, 2015

General information

95.99     Mar 23, 2015

DPS

DPS/KT 133

European Norm

25.160.50  

English  

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Scope

ISO 9453:2006 specifies the requirements for chemical composition for the following families of soft solder alloys:
tin-lead, with and without antimony, bismuth, cadmium, copper, and silver;
tin-antimony;
tin-bismuth;
tin-copper, with and without silver;
tin-indium, with and without silver and bismuth;
tin-silver, with and without copper and bismuth;
tin-zinc, with and without bismuth.
ISO 9453:2006 also includes an indication of the forms generally available.

Life cycle

NOW

WITHDRAWN
SSH EN ISO 9453:2006
95.99 Withdrawal of Standard
Mar 23, 2015

REVISED BY

WITHDRAWN
SSH EN ISO 9453:2014

Related project

Adopted from EN ISO 9453:2006