SSH EN 62418:2010

Semiconductor devices - Metallization stress void test

Publication date: May 27, 2011

General information

Current stage: 60.60 Effective date: May 27, 2011

Originator: DPS

Owner: DPS/KT 7

Type: European Norm

ICS: 31.080

Languages: English

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Status: Published

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Scope

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

Life cycle

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PUBLISHED
SSH EN 62418:2010
60.60 Standard published
May 27, 2011

Related project

Adopted from EN 62418:2010

Adopted from IEC 62418 Ed. 1.0 b

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