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SSH EN 60068-2-54:2006

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Sep 29, 2008
95.99 Withdrawal of Standard   Aug 1, 2023

General information

95.99     Aug 1, 2023

DPS

DPS/KT 6

European Norm

19.040     31.020  

English  

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Scope

Outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. It provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

Life cycle

NOW

WITHDRAWN
SSH EN 60068-2-54:2006
95.99 Withdrawal of Standard
Aug 1, 2023

REVISED BY

PUBLISHED
SSH EN 60068-2-69:2017

Related project

Adopted from EN 60068-2-54:2006

Adopted from IEC 60068-2-54 Ed. 2.0 en