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SSH EN 62137:2004

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Aug 28, 2008
95.99 Withdrawal of Standard   Apr 10, 2018

General information

95.99     Apr 10, 2018

DPS

DPS/KT 6

European Norm

31.190  

English  

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Scope

Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.

Life cycle

NOW

WITHDRAWN
SSH EN 62137:2004
95.99 Withdrawal of Standard
Apr 10, 2018

REVISED BY

PUBLISHED
SSH EN 62137-4:2014

Related project

Adopted from EN 62137:2004