Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
WITHDRAWN
SSH EN 60749-39:2006
95.99
Withdrawal of Standard
May 7, 2025
PUBLISHED
SSH EN IEC 60749-39:2022