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SSH EN 60749-21:2005

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

Jun 6, 2008
95.99 Withdrawal of Standard   Dec 17, 2014

General information

95.99     Dec 17, 2014

DPS

DPS/KT 7

European Norm

31.080  

English  

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Scope

Establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead or lead-free solder for the attachment. Provides a procedure for 'dip and look' solderability testing of through hole, axial and surface mount devices as well as an optional procedure for a board mounting solderability test for SMDs for the purpose of allowing simulation of the soldering process to be used in the device application.

Life cycle

NOW

WITHDRAWN
SSH EN 60749-21:2005
95.99 Withdrawal of Standard
Dec 17, 2014

REVISED BY

PUBLISHED
SSH EN 60749-21:2011

Related project

Adopted from EN 60749-21:2005

Adopted from IEC 60749-21 Ed. 1.0 b