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Grid-forming technology and applications in renewable energy dominated power systems
00.00 Proposal for new project received
Business Use Cases (BUCs) of Flexibility Services
10.20 New project ballot initiated
Primary Frequency Coordinated Control Framework of System with High Penetration of Inverter Based Generation
00.00 Proposal for new project received
Railway Applications – Requirements for software development
10.20 New project ballot initiated
Railway applications - Safety protocols for signaling applications - Part 1: Generic aspects of safety related transmission protocols
10.20 New project ballot initiated
Railway applicatios - Safety protocols for signaling applications - Part 3: PVS: Safety related transmission protocol for application between ground systems
10.20 New project ballot initiated
Railway applications - Safety protocols for signaling applications - Part 4: Rail Safe Transport Application Protocol
10.20 New project ballot initiated
Railway applications – Fixed installations – Lightning protection principles for overhead contact lines systems
10.20 New project ballot initiated
Materials for printed boards and other interconnecting structures - Part 2-XX: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate
10.60 Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad - Build-up film of defined dissipation factor (greater than 0,0030 and equal to or less than 0,0050 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
Test method for electrical materials, circuit board and other interconnection structures and assemblies - Part 2-X: Test methods for interconnection structures - Test methods for relative permeability and magnetic loss tangent of magnetic dielectric materials for circuit boards at 1 MHz to 1 GHz using impedance analyzer
10.60 Close of voting
Thermography test method for printed circuit interconnection defects
10.60 Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0050 and equal to or less than 0,0080 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
Materials for circuit boards and other interconnecting structures - Part 3-X: Sectional specification set for unreinforced base materials, clad and unclad – Build-up film of defined dissipation factor (greater than 0,0080 and equal to or less than 0,0200 at 10 GHz) for rigid organic package substrate, unclad
10.60 Close of voting
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