DPS
Drejtoria e Përgjithshme e Standardizimit
Phone: +355 4 222 62 55
E-mail: info@dps.gov.al
Address: Address: "Reshit Collaku" Str., (nearby ILDKPKI, VI floor), Po.Box 98, Tiranë - Albania
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Projects

Use the form below to find the searched projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”.

IEC 6xxxxx-3: Required Specifications of package substrates for advanced semiconductor packaging - Part 3 Standard Substrates structure for Current Induced Quality Test of Package Substrates

00.00 Proposal for new project received

TC 47/SC 47D more

Future IEC TR 60191-7-2 Ed.1: Thermal conductivity measurement method and samples for electronic components

00.00 Proposal for new project received

TC 47/SC 47D more

Thermal standardization on semiconductor packages – Part 7: Background and glossary of Thermal Simulation and Compact Thermal Models on Semiconductor Packaging

00.00 Proposal for new project received

TC 47/SC 47D more

Future IEC 63378-6-2 ED1: Thermal standardization on semiconductor packages - Part 6-2: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a measurement data of semiconductor device

10.60 Close of voting

TC 47/SC 47D more

Test method of sound variation detection sensors for fire detection

00.99 Approval to ballot proposal for new project

TC 47/SC 47E more

Semiconductor devices - Part 14-13: Semiconductor sensors - Performance test methods for spectral sensors

10.60 Close of voting

TC 47/SC 47E more

Semiconductor Devices - Part 16-XX: Microwave integrated circuits - Phase frequency detectors

10.60 Close of voting

TC 47/SC 47E more

Semiconductor devices - Part 20: Machine-Interpretable Data Sheet for Power Semiconductors: Requirements for Data Format and Data Access for Power Electronic Design Tools

10.20 New project ballot initiated

TC 47/SC 47E more

Semiconductor Sensors - Semiconductor Magnetic Current Sensors for Basic and Reinforced Insulation

10.20 New project ballot initiated

TC 47/SC 47E more

Semiconductor devices - Micro-electromechanical systems - Part 63: Tensile test of shape-memory MEMS materials under elevated temperature

10.20 New project ballot initiated

TC 47/SC 47F more

CONNECTORS FOR ELECTRONIC EQUIPMENT PRODUCT REQUIREMENTS Part 8-10X: Power connectors – Detail specification for 2-pole snap locking power rectangular connectors with plastic housing for rated current of 63 A

00.99 Approval to ballot proposal for new project

TC 48 more

Piezoelectric Sensors - Part 4: Quartz Crystal Microbalance

10.20 New project ballot initiated

TC 49 more

Integration of automated driving and related electrified road infrastructure

00.00 Proposal for new project received

SyC SET more

Rules for Steam Turbine Thermal Acceptance Tests - Part5 Steam Turbines in Combined Heat and Power (CHP) / District Heating (DH) Cycles

10.20 New project ballot initiated

TC 5 more

Inductors - Near Magnetic and Electric Field Characterization

00.00 Proposal for new project received

TC 51 more

Specifications for particular types of winding wires – Part 94: Polyesterimide overcoated with polyamide-imide enamelled round copper wire, class 220

10.20 New project ballot initiated

TC 55 more

Risk Analysis of change in Open Systems

10.60 Close of voting

TC 56 more

Risk Analysis of Open Systems

00.00 Proposal for new project received

TC 56 more