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High frequency inductive components - Electrical characteristics and measuring methods - Part 3: AC loss measured by sinusoidal wave of inductors for DC-to-DC converters
40.60 Close of voting
LED modules - Safety requirements
50.00 Final text received or FDIS registered for formal approval
Amendment 1 - Passive RF and microwave devices, intermodulation level measurement - Part 2: Measurement of passive intermodulation in coaxial cable assemblies
60.00 Standard under publication
Amendment 1 - Passive RF and microwave devices, intermodulation level measurement - Part 4: Measurement of passive intermodulation in coaxial cables
60.00 Standard under publication
Amendment 1 - Passive RF and microwave devices, intermodulation level measurement - Part 6: Measurement of passive intermodulation in antennas
60.00 Standard under publication
Passive RF and microwave devices, intermodulation level measurement - Part 7: Field measurements of passive intermodulation
30.60 Close of voting/ comment period
Uninterruptible power systems (UPS) - Part 1: Safety requirements
40.60 Close of voting
Uninterruptible power systems (UPS) - Part 5-1: DC output UPS - Safety requirements
20.99 WD approved for registration as CD
Amendment 1 - Uninterruptible power systems (UPS) - Part 5-3: DC output UPS - Performance and test requirements
20.99 WD approved for registration as CD
Cores made of soft magnetic materials - Measuring methods - Part 2: Magnetic properties at low excitation level
20.99 WD approved for registration as CD
Safety of machinery - Application of protective equipment to detect the presence of persons
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Semiconductor devices - Micro-electromechanical devices - Part 49: Temperature and humidity test methods for piezoelectric MEMS cantilevers
60.00 Standard under publication
Semiconductor devices - Micro-electromechanical devices - Part 51: Test method of electrical characteristics under two-directional cyclic bending deformation for flexible micro-electromechanical devices
40.00 DIS registered
Semiconductor devices - Micro-electromechanical devices - Part 52: Biaxial tensile testing method for stretchable MEMS
40.99 Full report circulated: DIS approved for registration as FDIS
Semiconductor devices - Micro-electromechanical devices - Part 54: Measurement method of tensile strength of microstructures
20.99 WD approved for registration as CD
Semiconductor devices - Micro-electromechanical devices - Part 55: Silicon based MEMS fabrication technology - Test method of microstructure pendulum impact
20.99 WD approved for registration as CD
Semiconductor devices - Micro-electromechanical devices - Part 56: Test method for characteristics of MEMS metal oxide semiconductor (MOS) type gas sensor
30.99 CD approved for registration as DIS
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