Use the form below to find the searched projects. Enter your criteria for searching (single or in combination) in the fields below and press the button “Search”.
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
60.60 Standard published
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
60.60 Standard published
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
60.60 Standard published
Circuit boards and circuit board assemblies - Design and use - Part 8: 3D shape data for CAD component library
60.60 Standard published
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
60.60 Standard published
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
60.60 Standard published
Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
60.60 Standard published
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-719: Test methods for materials for interconnection structures - Relative permittivity and loss tangent (500 MHz to 10 GHz)
60.60 Standard published
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using a split post dielectric resonator
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-801: Thermal conductivity test for base materials
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-803: Test methods for Z-axis expansion of base materials and printed boards
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-805: X/Y CTE test for thin base materials by TMA
60.60 Standard published
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (T<sub>d</sub>) using TGA
60.60 Standard published
Shqip