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Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonlinear vibration of MEMS resonators
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for MEMS piezoresistive pressure-sensitive device on wafer
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 35: Test method of electrical characteristics under bending deformation for flexible electro-mechanical devices
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 38: Test method for adhesion strength of metal powder paste in MEMS interconnection
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 41: RF MEMS circulators and isolators
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 42: Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
60.60 Standard published
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
60.60 Standard published
Electricity metering - Data exchange for meter reading, tariff and load control - Glossary of terms - Part 1: Terms related to data exchange with metering equipment using DLMS/COSEM
60.60 Standard published
Corrigendum 1 - Electricity metering - Data exchange for meter reading, tariff and load control - Glossary of terms - Part 1: Terms related to data exchange with metering equipment using DLMS/COSEM
60.60 Standard published
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