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Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
60.60 Standard published
Optical circuit boards - Performance standard - Part 3-1: Flexible optical circuit boards using unconnectorized optical glass fibres
60.60 Standard published
Device embedded substrate - Part 1-1: Generic specification - Test methods
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedded substrate - Part 1-1: Generic specification - Test methods
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
60.60 Standard published
Space product assurance - Design rules for printed circuit boards
40.20 DIS ballot initiated: 12 weeks
Space product assurance - Qualification and Procurement of printed circuit boards
40.20 DIS ballot initiated: 12 weeks
Enabling Circular Economy Practices: Repair and Recycling of PBAs
10.00 Proposal for new project registered
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
40.20 DIS ballot initiated: 12 weeks
Test methods for electrical materials, circuit boards and other interconnection structures and assemblies - Part 2-809: X/Y coefficient of thermal expansion (CTE) test for thick base materials by TMA
40.20 DIS ballot initiated: 12 weeks
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)
40.20 DIS ballot initiated: 12 weeks
Materials for printed boards and other interconnecting structures - Part 2-52: Reinforced base materials clad and unclad - Thermosetting hydrocarbon resin system, woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad
40.20 DIS ballot initiated: 12 weeks
Materials for printed boards and other interconnecting structures - Part 2-53: Reinforced base materials clad and unclad - PTFE unfilled laminate sheets of defined flammability (vertical burning test), copper-clad
40.20 DIS ballot initiated: 12 weeks
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
40.20 DIS ballot initiated: 12 weeks
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