Projects

Printed electronics - Part 403-1: Printability - Requirements for reproducibility - Basic patterns for evaluation of printing machine

60.60 Standard published

Printed electronics - Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate

60.60 Standard published

Flexible printed circuit boards (FPCBs) - Method of compensation of impedance variations

60.60 Standard published

Flexible printed circuit boards (FPCBs) - Method to decrease signal loss by using noise suppression materials

60.60 Standard published

Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress

60.60 Standard published

International Electrotechnical Vocabulary (IEV) - Part 543: Printed and flexible electronics

50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

30.99 CD approved for registration as DIS

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-501: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of solder fluxes

30.99 CD approved for registration as DIS

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate

40.00 DIS registered

Materials for printed boards and other interconnecting structures - Part 2-54: Reinforced base materials clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

40.99 Full report circulated: DIS approved for registration as FDIS

Materials for printed boards and other interconnecting structures - Part 2-55: Reinforced base materials clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined dissipation factor (less than 0,005 at 10 GHz) and flammability (vertical burning test), copper-clad for high speed applications

30.99 CD approved for registration as DIS

Materials for printed boards and other interconnecting structures - Part 2-56: Reinforced base materials clad and unclad – Non-halogenated epoxide modified bismaleimide/triazine with filler woven glass laminate sheets of low thermal expansion and flammability (vertical burning test), copper-clad for IC substrate

30.20 CD study/ballot initiated

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

30.60 Close of voting/ comment period

Printed electronics - Part 202-12: Materials - Rheological property measurement methods of inkjet ink for printed electronics

30.60 Close of voting/ comment period

Printed electronics - Part 202-13: Materials - Sheet resistance measurement method for conductive layer in printed and in-mould electronics

50.00 Final text received or FDIS registered for formal approval

Printed electronics - Part 202-14: Materials - Measurement methods for conductive ink properties specific to screen printing

40.99 Full report circulated: DIS approved for registration as FDIS

Printed electronics - Part 202-7: Materials - Printed film - Measurement of peel strength for printed layer on flexible substrate by 90° peel method

40.20 DIS ballot initiated: 12 weeks