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Printed electronics - Part 402-2: Printability - Measurement of qualities - Edge waviness of printed pattern using a two-dimensional optical image
40.60 Close of voting
Printed electronics - Part 402-8: Printability - Measurement of qualities - Shape pattern dimension
50.99 FDIS or proof approved for publication
Printed electronics - Part 403-2: Printability - Requirements for reproducibility - Basic patterns for printing plate
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Fixed folding durability test method for flexible opto-electric circuit boards
40.99 Full report circulated: DIS approved for registration as FDIS
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant
30.60 Close of voting/ comment period
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements
30.60 Close of voting/ comment period
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements - Part 3: Determination for temperature measurement in miniaturised surface mounting devices using thermocouples
30.20 CD study/ballot initiated
Rigid circuit board - Routing parameters
50.00 Final text received or FDIS registered for formal approval
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